Thermal Conductive Grease
Silicone Thermal Conductive Grease 0111 thermal grease for cpu or LED chip
Silicone Thermal Conductive Grease 0111 thermal grease for cpu or LED chip
Product Details:
| Place of Origin: | China |
| Brand Name: | HUITIAN |
| Certification: | SGS |
| Model Number: | 0111 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 250KG |
|---|---|
| Price: | Negotiation |
| Packaging Details: | 2kg/bucket,6 buckets/carton |
| Delivery Time: | 5-8 WORK DAYS |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 5000 KG MONTH |
Product details
|
Detail Information |
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| Physical Form: | Paste | Color: | White |
|---|---|---|---|
| Main Component: | Polysiloxane | Density: | 2.5 |
| Volatility(200â,24h): | 0.2 | Heat Conductivity Coefficient: | 1.2 W/(mâ¢K) |
| Work Temperature: | -50~200 | ||
| High Light: |
silicone thermal grease,high performance thermal compound |
||
Product Description
â Product Features :
Ø Single component, white color.
Ø Physical form: paste
Ø Made of metallic oxide and polysiloxane
Ø Wide operating temperature range
Ø Nontoxic, non-corrosive
Ø Eco-friendly, odorless
Ø Doesn’t go dry and flowing at high temperature.
Ø High performance on insulation, damp proofing, corona resistance, electric leakage resistance and chemical resistance.
Ø Can be dispensed both by hand or machine.
Ø Heat conductivity coefficient: 1.2 W/(m·K)
â Technical Data :
| Item | Unit | Typical Value |
| Item No. | 0111 | |
| Physical Form | paste | |
| Color | white | |
| Main Component | polysiloxane | |
| Density | g/cm 3 | 2.5 |
| Penetration Degree | 1/10cm | 330 |
| Volatility(200 â ,24h) | % | 0.2 |
| Volume Resistivity | Ω*cm | 1.0×10 15 |
| Dielectric Strength | KV/mm | 24 |
| Breakdown Voltage | KV/mm | 20 |
| Surface Resistance | Ω | 2.5×10 14 |
| 0.1mm Thermal Resistance | m 2 K/W | 0.00015 |
| Work Temperature | â | -50~200 |
| Heat Conductivity Coefficient | W/(m·K) | 1.2 |
â Main Applications:
Ø Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
Ø For the filling of gap between high-power audion, thyrister and basic materials such as copper and aluminum to reduce the temperature of electronic components.
â How to Use
Ø Stir this product before using if it’s long time unused.
Ø Clean the object surfaces to get rid of oil and dirty before use.
Ø The object surfaces should be even and uniform.
Ø To dispense smoothly, please stir for 2 minutes before use.
Ø Apply a little for try before massive use.
Ø Only a thin layer of this product needed for use to avoid wastes.
Ø Do not keep this product exposed in the air for a long time.
â Packing :
Ø 2kg/bucket, 6buckets/carton