|Place of Origin:||CHINA|
|Minimum Order Quantity:||60kg|
|Payment Terms:||L/C, T/T|
|Supply Ability:||1000KG MONTH|
|Volatility(200â,24h):||0.2%||Heat Conductivity Coefficient:||2.6 W/(mâ¢K)|
high performance thermal compound,
silicone thermal grease
â Product Features:
Ø Single component, grey color.
Ø Physical form: paste
Ø Made of metallic oxide and polysiloxane
Ø Wide operating temperature range
Ø Nontoxic, non-corrosive
Ø Eco-friendly, odorless
Ø Its stability and thermal conductivity kept even at the temperature of 150â
Ø Doesn’t go dry and flowing at high temperature.
Ø Suitable for dispensing by hand
Ø Heat conductivity coefficient: 2.6W/(m·K)
â Main Applications:
Ø Widely used for the thermal conductivity of electronic components including the filling of gap between CPU, BGA, LED, power source, high-power audion, thyrister and basic materials such as copper and aluminum to reduce the temperature of electronic components.
â How to Use
Ø Stir this product before using if it’s long time unused.
Ø Clean the object surfaces to get rid of oil and dirty before use.
Ø The object surfaces should be even and uniform.
Ø To dispense smoothly, please stir for 2 minutes before use.
Ø Apply a little for try before massive use.
Ø Only a thin layer of this product needed for use to avoid wastes.
Ø Do not keep this product exposed in the air for a long time.
Ø 1kg/bucket, 12buckets/carton
â Technical Data:
|Volume Resistivity||Ω*cm||1.0×10 15|
|Surface Resistance||Ω||1.6×10 12|
|0.1mm Thermal Resistance||m 2 K/W||0.00007|
|Heat Conductivity Coefficient||W/(m·K)||2.6|
Ø Store it in dry and shady places at the temperature of 8~28â
Ø Storage life is 12 months from the date of manufacture.
Ø Keep it away from children.
Ø In case of contact with skins, wipe and then flush with clear water.
Ø In case of contact with eyes, flush with clear water immediately and go to hospital for checking.
Ø For the use of this product, it’s not the more the better but the thinner the better under the condition of full filling of gaps is assured.